Yamaha S10 second-hand chip mounter machine

Model Number

S10

Board size(with buffer unused)

Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)

Board size(with input or output buffer used)

Min. L50 x W30mm to Max. L420 x W510mm

Board size(with input and output buffers used)

Min. L50 x W30mm to Max. L330 x W510mm

Board thickness

0.4 - 4.8mm

Board flow direction

Left to right (Std)

Board transfer speed

Max 900mm/sec

Placement speed (12 heads + 2 theta) Opt. Cond.

0.08sec/CHIP (45,000CPH)

Placement accuracy A (μ+3σ)

CHIP +/-0.040mm

Placement accuracy B (μ+3σ)

IC +/-0.025mm

Placement angle

+/-180 degrees

Z axis control / Theta axis control

AC servo motor

Component height

Max 30mm*1 (Pre-placed components: max 25mm)

Applicable components

0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)

Component package

8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray

Drawback check

Vacuum check and vision check

Screen language

English, Chinese, Korean, Japanese

Board positioning

Board grip unit, front reference, auto conveyor width adjustment

Component types

Max 90 types (8mm tape), 45 lanes x 2

Transfer height

900 +/- 20mm

Machine dimensions, weight

L1250xD1750xH1420mm, Approx. 1,200kg