KTE-800D dual rail smd lead free reflow oven equipment
Advantage:
1. Totally meet various requirements for the lead free processing.
2. Windows XP operation system, Chinese/English can be switched online.
3. Standard air oven, Patent air system, using hot air convection conduction heat faster, more efficient compensation.
4. PLC+PID closed loop control to achieve high precision temperature control and repeatable profiles.
5. Dual temperature sensors and dual safety control, system shall cut off the power while abnormal alarm.
6. Modular design to get quick and simple maintenance so that reducing the maintenance time & cost.
7. Double-track dual-speed, single machine cost, double production capacity, energy saving up to 65%.
Keywords:
SMT Reflow Oven, Lead free Reflow Oven, High end Reflow Oven, Reflow Soldering Oven, Reflow Oven Manufacturer, LED Reflow Oven, PCB Reflow Oven, Nitrogen Reflow Oven, Customized Reflow Oven, dual rail smd lead free reflow oven equipment
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Machine Specification
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Model |
KTE-800D |
Control |
Industrial computer |
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Heating zones qty. |
Top 8, bottom 8 |
Cooling zones qty. |
Top 2 |
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Heating zone length |
3110mm |
Rectifying plate |
Galvanized plate |
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Weight |
Approx.:2645KG |
Dimension |
5378x1610x1490mm |
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Exhaust capacity |
10㎡/min×2 |
Color |
Grey |
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Control system |
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Electricity supply |
3P 380V/220V 50/60HZ |
Temp. control range |
Room temp.～300℃ |
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Total power |
70KW |
Temp. control accuracy |
±1℃（static state） |
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Start power |
32KW |
Temp. control method |
PID +SSR drive |
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Consumption power |
11KW |
PCB temperature deviation |
±1.5℃ |
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Speed control |
Inverter adjust |
Data save |
All profiles can be saved |
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Warm up time |
Approx.30minute |
Abnormal alarm |
High, low temp. alarm |
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Conveying system |
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Rail structure |
2 sectional rails |
Rail fixed method |
1,4 fix, 2,3 moving |
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Chain |
Stuck-free type |
Conveying height |
900±20mm |
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PCB Max. width |
50-400mm |
Conveying method |
Rail+ mesh+ chain |
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Component height |
Top/bottom 25mm |
Conveying speed |
300-2000mm |
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Conveying direction |
Left to right |
Lubrication |
Automatic |
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Cooling system |
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Cooling method |
Forced air cooling |
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Heating features |
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Heating zones |
Top 8,bottom 8（3110mm）can meet the need of the peak lead-free technique. |
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Cooling zones |
After cool down by air, PCB temp. is ≤70℃ at the exit. |
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Warm up time |
From the normal temp. to set temp, approximate 30 minutes. |
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Warm up sequence |
Warm up from two side, save the power and time |
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Profile transfer time |
＜15min |
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Heating zone temp. control accuracy |
±1℃ |
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PCB temp. deviation |
±1.5℃ |
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Empty to full load heat balance respond time |
≤20 s |
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