COB strip light bonding machine
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LED卷料式固晶机 LED roll Crystal fixing machine |
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Model |
LKS80A |
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Warranty |
12 months
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系统功能 System |
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生产周期 production cycle |
90ms(周期取决于晶片尺寸及支架) |
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XY精度 XY accuracy |
±1mil(±0.025mm) |
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芯片旋转 chip rotation |
±3° |
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芯片XY工作台 Chip XY work table |
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芯片尺寸 chip size |
3mil*3mil-80mil*80mil(0.076mm*0.076mm-2mm*2mm) |
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分辨率 resolution ration |
0.04mil(1μm) |
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芯片最大角度修正 chip maximum angle correction |
±15° |
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最大芯片环尺寸 max chip ring size |
6″（152mm）外径 |
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最大芯片面积尺寸max chip area |
4.7″（119mm）扩张后 |
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顶针 Z 高度行程 Thimble Z height stroke |
80mil（2mm） |
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图像识别系统 Image recognize system |
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灰阶度 Gray scale |
256 级灰度 256 degree |
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分辨率 resolution ration |
656×492 像素 656*492 pixel |
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图像识别精准度image recognize accuracy |
±0.025mil@50mil 观测范围 ±0.025mil@50mil observation range |
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吸晶摆臂机械手系统 Crystal absorbing swing arm robotic hand system |
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吸晶摆臂 Crystal absorbing swing arm |
90°可旋转固晶 90°rotatable solid crystal |
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吸晶压力 Crystal absorbing pressure |
可调 30g—250g 30g-250g can be adjusted |
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送料工作平台 Feeding work table |
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行程范围 travel area |
/ |
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XY 分辨率 XY resolution ration |
0.02mil(0.5μm) |
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适用支架尺寸 Suitable bracket size |
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支架长度 length of bracket |
/ |
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支架宽度 width of bracket |
最大120mm |
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所需设施 Required facilities |
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电压/频率 Power |
220V AC±5%/50HZ |
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压缩空气 Air pressure |
0.5MPa（MIN） |
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额定功率 Rated power |
1600W |
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耗气量 Gas consumption |
40L/min |
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体积及重量 Dimension & weight |
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长 x 宽 x 高 L*W*H |
189*100*175cm |
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重量 Weight |
1300kg |
