Automatic Die-bonding machine
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LED roll Crystal fixing machine |
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Model |
GTS80A |
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System |
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production cycle |
90ms(周期取决于晶片尺寸及支架) |
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XY accuracy |
±1mil(±0.025mm) |
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chip rotation |
±3° |
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Chip XY work table |
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chip size |
3mil*3mil-80mil*80mil(0.076mm*0.076mm-2mm*2mm) |
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resolution ration |
0.04mil(1μm) |
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chip maximum angle correction |
±15° |
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max chip ring size |
6″（152mm）(External Diameter) |
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max chip area |
4.7″（119mm）(Expanded) |
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Thimble Z height stroke |
80mil（2mm） |
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Image recognize system |
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Gray scale |
256 degrees grey |
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resolution ration |
656*492 pixels |
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image recognize accuracy |
±0.025mil@50mil observation range |
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Crystal absorbing swing arm robotic hand system |
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Crystal absorbing swing arm |
90°rotatable solid crystal |
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Crystal absorbing pressure |
30g-250g can be adjusted |
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Feeding work table |
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travel area |
/ |
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XY resolution ration |
0.02mil(0.5μm) |
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Suitable bracket size |
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length of bracket |
/ |
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width of bracket |
Max 120mm |
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Required facilities |
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Power |
220V AC±5%/50HZ |
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Air pressure |
0.5MPa（MIN） |
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Rated power |
1600W |
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Gas consumption |
40L/min |
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Dimension & weight |
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L*W*H |
189*100*175cm |
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Weight |
1300kg |
