500g SMT Lead free No-clean solder paste

item: solder paste

500g/ bottle

Printing pressure:1.0-2.0

Sn 96.5 Ag 3.0 Cu 0.5

Product description: solder paste, no-clean solder paste, smt solder paste, lead free solder paste, smt solder paste powders, smt solder powders

500g SMT Lead free No-clean solder paste

solder paste

keywords

solder paste, no-clean solder paste, smt solder paste, lead free solder paste, smt solder paste powders, smt solder powders, tin solder paste

Introduce

Refined by special soldering fluid and spherical Sn Ag or SnAgCu eutectic powder,SQ lead-free no-clean solder past is featured with excellent and continuous printing solution and by adopting high-reliable low iconicity halogen system, the residues after soldering have higher reliability even if it is no-clean.

Product Features

1.Favorable continuous printing stability and having less bubble;

2.The PCB plate with 0.3mm interval can be applied to the refining printing without icicles and collapse;

3. Good wetting property and the paster Will not be distorted, is capable to protect and paste product effectively

4. The welding spot is smooth and full, being with good diffusivity.

5.The residues after welding are few. coloriess and transparent,

having large area of insulation resistance. it will not corrode

PCB but can comply with the no-clean requirements.

Specification

Model	Metal composition	Melting point（℃）	Usage
SQ-10-30B	Sn 96.5 Ag 3.0 Cu 0.5	217-219	Lead-free soldering
SQ-10-10D	Sn 99 Ag 0.3 Cu 0.7	227-229	Lead-free soldering
SQ-10-10B	Sn 42 Bi58	138	SMT/Radiator
SQ-10-10C	Sn 64 Bi35 Ag1.0	183	Lead-free soldering
SQ-10-10A	Sn 98.5 Ag 1.0 Cu 0.5	217-227	Lead-free soldering
SQ-20-10D	Sn 99.3 Cu 0.7	227-229	Lead-free soldering